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INTEL - XEON Gold 6152 2.1Ghz 22 Core Socket 3647

INTEL - XEON Gold 6152 2.1Ghz 22 Core Socket 3647 no FAN

#INI632 - BX806736152

Nuovo

Disponibilità: Arrivo previsto in circa 4gg

3 825,00 €   IVA Esclusa

4 666,50 €   IVA Inclusa

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CPU part number
  • BX806736152
Frequency 2100 MHz
Maximum turbo frequeNcy3700 MHz
Bus speed 10.4 GT/s UPI
Clock multiplier 21
Package3647-land Flip-Chip Land Grid Array (FC-LGA)
SocketSocket 3647
MicroarchitectureSkylake
PlatformPurley
Processor core Skylake-SP
Core stepping H0 (SR3B4)
Manufacturing process0.014 micron
DieXCC type
Data width64 bit
The number of CPU cores22
The number of threads44
Floating Point UnitIntegrated
Level 1 cache size 22 x 32 KB instruction caches
22 x 32 KB data caches
Level 2 cache size 22 x 1 MB caches
Level 3 cache size30.25 MB non-inclusive shared cache
Physical memory768 GB
MultiprocessingUp to 4 processors
Features
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • AVX2 / Advanced Vector Extensions 2.0
  • AVX-512 / Advanced Vector Extensions 512
  • BMI / BMI1 + BMI2 / Bit Manipulation instructions
  • F16C / 16-bit Floating-Point conversion instructions
  • FMA3 / 3-operand Fused Multiply-Add instructions
  • EM64T / Extended Memory 64 technology / Intel 64 
  • NX / XD / Execute disable bit 
  • HT / Hyper-Threading technology 
  • VT-x / Virtualization technology 
  • VT-d / Virtualization for directed I/O
  • TBT 2.0 / Turbo Boost technology 2.0 
  • TXT / Trusted Execution technology
  • TSX / Transactional Synchronization Extensions
Low power featuresEnhanced SpeedStep technology 
Integrated peripherals / components
Integrated graphicsNone
Memory controllerThe number of controllers: 2
Memory channels per controller: 3
Supported memory: DDR4-2666
DIMMs per channel: 2
ECC supported: Yes
Other peripherals
  • Ultra Path Interconnect (3 links)
  • PCI Express 3.0 interface (48 lanes)
  • Direct Media Interface 3.0 (4 lanes)
Electrical / Thermal parameters
Maximum operating temperature 92°C (case temperature)
98°C (Digital Thermal Sensor)
Thermal Design Power140 Watt

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