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INTEL - XEON Silver 4214R 2.4Ghz 12 Core Socket 3647 no FAN

INTEL - XEON Silver 4214R 2.4Ghz 12 Core Socket 3647 no FAN

#INI715 - BX806954214R 

Nuovo

Disponibilità: Prodotto Esaurito

Frequency 2400 MHz
Maximum turbo frequency3500 MHz
Bus speed 9.6 GT/s UPI
Clock multiplier 24
Package3647-land Flip-Chip Land Grid Array (FC-LGA)
SocketSocket 3647
MicroarchitectureCascade Lake
Processor core Cascade Lake-SP
Core stepping L1 (SRG1W)
Manufacturing process0.014 micron
Data width64 bit
The number of CPU cores12
The number of threads24
Floating Point UnitIntegrated
Level 1 cache size 12 x 32 KB instruction caches
12 x 32 KB data caches
Level 2 cache size 12 x 1 MB caches
Level 3 cache size16.5 MB shared cache
Physical memory1 TB
MultiprocessingUp to 2 processors
Extensions and Technologies
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • AVX2 / Advanced Vector Extensions 2.0
  • AVX-512 / Advanced Vector Extensions 512
  • BMI / BMI1 + BMI2 / Bit Manipulation instructions
  • Deep Learning Boost
  • F16C / 16-bit Floating-Point conversion instructions
  • FMA3 / 3-operand Fused Multiply-Add instructions
  • EM64T / Extended Memory 64 technology / Intel 64 
  • HT / Hyper-Threading technology 
  • VT-x / Virtualization technology 
  • VT-d / Virtualization for directed I/O
  • TBT 2.0 / Turbo Boost technology 2.0 
  • TSX / Transactional Synchronization Extensions
Security Features
  • NX / XD / Execute disable bit 
  • TXT / Trusted Execution technology
  • SMAP / Supervisor Mode Access Prevention
  • SMEP / Secure Mode Execution Protection
Low power features
  • Enhanced SpeedStep technology 
Memory controllerThe number of controllers: 1
Memory channels: 6
Supported memory: DDR4-2400
ECC supported: Yes
Other peripherals
  • Ultra Path Interconnect (2 links)
  • PCI Express 3.0 interface (48 lanes)
Electrical / Thermal parameters
Maximum operating temperature 79°C
Thermal Design Power 100 Watt

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