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INTEL - CORE i7 6700 3.4Ghz Skylake Socket 1151 BOXED
#INI552 - BX80662I76700
Nuovo
CORE i7 6700 3.4Ghz Skylake Socket 1151 BOXED
| Model number | i7-6700 |
| CPU part number |
|
| Frequency | 3400 MHz |
| Turbo frequency | 4000 MHz (1 core) 3900 MHz (2 cores) 3800 MHz (3 cores) 3700 MHz (4 cores) |
| Bus speed | 8 GT/s DMI |
| Clock multiplier | 34 |
| Package | 1151-land Flip-Chip Land Grid Array |
| Socket | Socket 1151 / H4 / LGA1151 |
| Microarchitecture | Skylake |
| Processor core | Skylake-S |
| Core stepping | R0 (SR2BT, SR2L2) |
| CPUID | 506E3 (SR2BT, SR2L2) |
| Manufacturing process | 0.014 micron |
| Data width | 64 bit |
| The number of cores | 4 |
| The number of threads | 8 |
| Floating Point Unit | Integrated |
| Level 1 cache size | 4 x 32 KB 8-way set associative instruction caches 4 x 32 KB 8-way set associative data caches |
| Level 2 cache size | 4 x 256 KB 4-way set associative caches |
| Level 3 cache size | 8 MB 16-way set associative shared cache |
| Physical memory | 64 GB |
| Multiprocessing | Uniprocessor |
| Features |
|
| Low power features | Enhanced SpeedStep technology |
| Integrated peripherals / components | |
| Integrated graphics | GPU Type: HD 530 Microarchitecture: Gen 9 LP Base frequency (MHz): 350 Maximum frequency (MHz): 1150 The number of supported displays: 3 |
| Memory controller | The number of controllers: 1 Memory channels: 2 Supported memory: DDR3L-1333, DDR3L-1600, DDR4-1866, DDR4-2133 DIMMs per channel: 2 Maximum memory bandwidth (GB/s): 34.1 |
| Other peripherals |
|
| Electrical / Thermal parameters | |
| Thermal Design Power | 65 Watt |