INTEL - Celeron G4900 3.1Ghz Socket 1151v2 Boxed

#INI709 - BX80684G4900

Nuovo

Frequency 3100 MHz
Low power frequency800 MHz
Bus speed 8 GT/s DMI
Clock multiplier 31
SocketSocket 1151
MicroarchitectureCoffee Lake
Processor core Coffee Lake-S
Core stepping B0 (QP9G, SR3W4)
Manufacturing process0.014 micron
Data width64 bit
The number of CPU cores2
The number of threads2
Floating Point UnitIntegrated
Level 1 cache size 2 x 32 KB 8-way set associative instruction caches
2 x 32 KB 8-way set associative data caches
Level 2 cache size 2 x 256 KB 4-way set associative caches
Level 3 cache size2 MB 8-way set associative shared cache
Physical memory64 GB
MultiprocessingUniprocessor
Extensions and Technologies
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 
  • AES / Advanced Encryption Standard instructions
  • EM64T / Extended Memory 64 technology / Intel 64 
  • VT-x / Virtualization technology 
  • VT-d / Virtualization for directed I/O
Security Features
  • NX / XD / Execute disable bit 
  • MPX / Memory Protection Extensions
  • SGX / Software Guard Extensions
  • SMAP / Supervisor Mode Access Prevention
  • SMEP / Secure Mode Execution Protection
Low power features
  • Core C1/C1E, C3, C6, C7, C8, C9 and C10 states
  • Package C2, C3, C6, C7, C8, C9 and C10 states
  • Enhanced SpeedStep technology 
Integrated peripherals / components
Display controller
  • 3 displays
  • DVI / DisplayPort 1.2 / Embedded DisplayPort 1.4 / HDMI 1.4
Integrated graphicsGPU Type: Intel UHD 610
Graphics tier: GT1
Microarchitecture: Gen 9 LP
Base frequency (MHz): 350
Maximum frequency (MHz): 1050
Memory controllerThe number of controllers: 1
Memory channels: 2
Channel width (bits): 64
Supported memory: DDR4-2400
DIMMs per channel: 2
Maximum memory bandwidth (GB/s): 38.4
ECC supported: Yes
Other peripherals
  • Direct Media Interface 3.0 (4 lanes)
  • PCI Express 3.0 interface (16 lanes)
Thermal Design Power 54 Watt

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